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Ply-by-Ply Failure Analysis of Laminates Under Dynamic Loading

Ravi Joshi*, P. Pal

Civil Engineering Department, Motilal Nehru National Institute of Technology Allahabad, Prayagraj, 211004, India

* Corresponding Author: Ravi Joshi. Email: email

Sound & Vibration 2021, 55(2), 173-190. https://doi.org/10.32604/sv.2021.011387

Abstract

Ply-by-ply failure analysis of symmetric and anti-symmetric laminates under uniform sinusoidal transverse dynamic loading is performed for a specified duration. The study investigates the first ply failure load, followed by the detection of successive ply failures along with their failure modes using various failure theories. Some of the well-established failure theories, mostly used by the researchers, are considered for the failure prediction in laminates. The finite element computational model based on higher order shear deformation displacement field is used for the failure analysis and the complete methodology is computer coded using FORTRAN. The ply-discount stiffness reduction scheme is employed to modify the material properties of the failed lamina. The failure theories used in the analysis are compared according to their ability to predict failure load, failed ply, failure mode and progression of failure. The failure analysis is performed for both the cross-ply and angle-ply laminates with all edges simply supported and clamped. The significance of fibre orientation and stacking sequence in terms of the strength of a laminate and failure progression is also highlighted.

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Cite This Article

APA Style
Joshi, R., Pal, P. (2021). Ply-by-ply failure analysis of laminates under dynamic loading. Sound & Vibration, 55(2), 173-190. https://doi.org/10.32604/sv.2021.011387
Vancouver Style
Joshi R, Pal P. Ply-by-ply failure analysis of laminates under dynamic loading. Sound Vib . 2021;55(2):173-190 https://doi.org/10.32604/sv.2021.011387
IEEE Style
R. Joshi and P. Pal, “Ply-by-Ply Failure Analysis of Laminates Under Dynamic Loading,” Sound Vib. , vol. 55, no. 2, pp. 173-190, 2021. https://doi.org/10.32604/sv.2021.011387



cc Copyright © 2021 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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