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Ultrasonic Wireless Communication Through Metal Barriers

Jianing Zhang1,2, Ziying Yu1, Hengxu Yang1,2, Ming Wu1, Jun Yang1,2,*

1 State Key Laboratory of Acoustics and Key Laboratory of Noise and Vibration Research, Institute of Acoustics, Chinese Academy of Sciences, Beijing, China.
2 University of Chinese Academy of Sciences, Beijing, China.
* Corresponding Author: Jun Yang. Email: jyang@mail.ioa.ac.cn.

Sound & Vibration 2019, 53(2), 2-15. https://doi.org/10.32604/sv.2019.03783

Abstract

Ultrasound can be used as a carrier to realize wireless communication to and from a metal-enclosed space, which has the characteristics such as immunity to the electromagnetic shielding effect and non-destructive penetration of metal obstacles. This paper firstly reviews the previous studies in the field of ultrasonic wireless communication through metal barriers, and summarizes their achievements and the existing problems. Secondly, an overview of the research methods involved in studying the characteristic of acoustic-electric channel is presented, and the principles are introduced for the actual measurement method, equivalent circuit method, ABCD parameter method, finite element analysis method and time-domain finite difference method. Then, an overview of the communication algorithms are presented such as orthogonal frequency division multiplexing (OFDM), single-carrier frequency domain equalization and multiple input multiple output OFDM. Finally, the potential future study are proposed in light of the trend of development and unsolved problems.

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Cite This Article

APA Style
Zhang, J., Yu, Z., Yang, H., Wu, M., Yang, J. (2019). Ultrasonic wireless communication through metal barriers. Sound & Vibration, 53(2), 2-15. https://doi.org/10.32604/sv.2019.03783
Vancouver Style
Zhang J, Yu Z, Yang H, Wu M, Yang J. Ultrasonic wireless communication through metal barriers. Sound Vib . 2019;53(2):2-15 https://doi.org/10.32604/sv.2019.03783
IEEE Style
J. Zhang, Z. Yu, H. Yang, M. Wu, and J. Yang, “Ultrasonic Wireless Communication Through Metal Barriers,” Sound Vib. , vol. 53, no. 2, pp. 2-15, 2019. https://doi.org/10.32604/sv.2019.03783

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cc Copyright © 2019 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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