Open Access

ARTICLE

Study on Reaction Diffusion Behavior in NG-Al/CG-Cu Diffusion Couple

B. Xu¹, W.P. Tong¹, H. Zhang¹, L. Zuo¹, J. C. He¹

1 Key Laboratory of Electromagnetic Processing of Materials, Ministry of Education, Northeastern University, Shenyang 110819, China

Structural Longevity 2012, 8(3), 139-148. https://doi.org/10.3970/sl.2012.008.139

Abstract

A novel technique has been developed to produce nanostructuregrained (NG) Al coatings on Cu plate by means of surface mechanical attrition treatment (SMAT). The reaction diffusion behavior in nanostructure-grained (NG) Al/course-grained (CG) Cu diffusion couple was investigated by scanning electron microscopy (SEM) and transmission electron microscopy (TEM). The experimental results showed that the aluminizing kinetics of NG coating on Cu plate was obviously enhanced, and the temperature to form compound layer was also greatly reduced with respect to the coarse-grained (CG) Al/coarse-grained (CG) Cu diffusion couple. The activation energy for compound layer growth in the NG-Al/CG-Cu diffusion couple was calculated from the temperature dependence of compound layer thickness, the obtained values being about 97.85 kJ/mol, which is much smaller than that in the previous report for Al diffusion in the CG Cu (136 kJ/mol).

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Keywords

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