Open Access
ARTICLE
Mechanical Properties Measurement of Soft Materials by Three-Dimensional Digital Image Correlation Method
Wei-Chung Wang1, Yu-An Chiang1, Yi-Chieh Ho1, Hung-Tsan Shen1, Ting-Yu Chang1, Ya-Hsin Chang1, Chun-Sheng Tsao1
1 Department of Power Mechanical Engineering, National Tsing Hua University, Hsinchu, Taiwan,
Republic of China
Structural Longevity 2012, 7(3), 151-160. https://doi.org/10.3970/sl.2012.007.151
Abstract
The rapid development of soft materials in recent years gives revolutionary impact on electronics and biomedical industries. To better control the
quality and key technology, mechanical properties of soft materials employed in
electronics and biomedical industries must be accurately determined By employing the non-destructive, non-contact and whole-field characteristics of the threedimensional (3D) digital image correlation (DIC) method, epoxy resin used in photoviscoelasticity, mechanical properties of optical films used in backlight modules
and artificial meshes used in biomedical applications were investigated in this paper. It was found that satisfactory accuracy and measurement range can be obtained
from the 3D-DIC method on the measurement of mechanical properties of soft materials.
Keywords
Cite This Article
Wang, W., Chiang, Y., Ho, Y., Shen, H., Chang, T. et al. (2012). Mechanical Properties Measurement of Soft Materials by Three-Dimensional Digital Image Correlation Method.
Structural Longevity, 7(3), 151–160. https://doi.org/10.3970/sl.2012.007.151