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Transient coupled thermoelastic crack analysis in functionally graded materials1

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1 In memory of Prof. Dr.-Ing. F.-G. Buchholz
2 Department of Civil Engineering, University of Siegen, D-57068 Siegen, Germany
3 Institute of Construction and Architecture, Slovak Academy of Sciences, 84503 Bratislava, Slovakia

Structural Durability & Health Monitoring 2010, 6(3&4), 329-350. https://doi.org/10.3970/sdhm.2010.006.329

Abstract

In this paper, transient crack analysis in two-dimensional, isotropic, continuously non-homo -ge -neous and linear elastic functionally graded materials is presented. A boundary-domain element method based on boundary-domain integral representations is developed. The Laplace-transform technique is utilized to eliminate the dependence on time. Laplace-transformed fundamental solutions of linear coupled thermoelasticity for isotropic, homogeneous and linear elastic solids are applied to derive boundary-domain integral equations. The numerical implementation is performed by using a collocation method for the spatial discretization. The time-dependent numerical solutions are obtained by the Stehfest's inversion algorithm. For an edge crack in a finite domain under thermal shock, the dynamic stress intensity factors are presented and discussed.

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APA Style
Ekhlakov, A., Khay, O., Zhang, C., Sladek, J., Sladek, V. (2010). Transient coupled thermoelastic crack analysis in functionally graded materials1. Structural Durability & Health Monitoring, 6(3&4), 329-350. https://doi.org/10.3970/sdhm.2010.006.329
Vancouver Style
Ekhlakov A, Khay O, Zhang C, Sladek J, Sladek V. Transient coupled thermoelastic crack analysis in functionally graded materials1. Structural Durability Health Monit . 2010;6(3&4):329-350 https://doi.org/10.3970/sdhm.2010.006.329
IEEE Style
A. Ekhlakov, O. Khay, C. Zhang, J. Sladek, and V. Sladek, “Transient coupled thermoelastic crack analysis in functionally graded materials1,” Structural Durability Health Monit. , vol. 6, no. 3&4, pp. 329-350, 2010. https://doi.org/10.3970/sdhm.2010.006.329



cc Copyright © 2010 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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