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Electroelastic Problem of Two Anti-Plane Collinear Cracks at the Interface of Two Bonded Dissimilar Piezoelectric Layers

B. M. Singh, J. Rokne, R. S. Dhaliwal1

1 Department of Mathematics and Statistics, The University of Calgary, Calgary, Alberta, Canada T2N-1N4. Dr. Dhaliwal, Professor Emeritus, passed away suddenly on October 10, 2007.

Structural Durability & Health Monitoring 2008, 4(2), 95-106. https://doi.org/10.3970/sdhm.2008.004.095

Abstract

Under the permeable electric boundary condition the problem of two collinear anti-plane shear cracks situated at the interface of two bonded dissimilar piezoelectric layers is considered. It is assumed that applied longitudinal shear stress and electric loading at the layer surfaces are prescribed. By the use of Fourier transforms we reduce the problem to solving a set of triple integral equations with a cosine kernel. The triple integral equations are further reduced to a Fredholm integral equation of the second kind whose iterative solution has been obtained. Analytical expressions for the stress intensity factors are obtained. Numerical results are presented in the form of graphs and compared with the results of stress intensity factors of two collinear cracks in a homogeneous elastic layer.

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APA Style
Singh, B.M., Rokne, J., Dhaliwal, R.S. (2008). Electroelastic problem of two anti-plane collinear cracks at the interface of two bonded dissimilar piezoelectric layers. Structural Durability & Health Monitoring, 4(2), 95-106. https://doi.org/10.3970/sdhm.2008.004.095
Vancouver Style
Singh BM, Rokne J, Dhaliwal RS. Electroelastic problem of two anti-plane collinear cracks at the interface of two bonded dissimilar piezoelectric layers. Structural Durability Health Monit . 2008;4(2):95-106 https://doi.org/10.3970/sdhm.2008.004.095
IEEE Style
B.M. Singh, J. Rokne, and R.S. Dhaliwal, “Electroelastic Problem of Two Anti-Plane Collinear Cracks at the Interface of Two Bonded Dissimilar Piezoelectric Layers,” Structural Durability Health Monit. , vol. 4, no. 2, pp. 95-106, 2008. https://doi.org/10.3970/sdhm.2008.004.095



cc Copyright © 2008 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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