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Numerical Evaluation of T-stress Solutions for Cracks in Plane Anisotropic Bodies

by P.D. Shah1, Ch. Song2, C.L. Tan1, X. Wang1

1 Carleton University, Ottawa, Canada
2 University of New South Wales, Sydney, Australia

Structural Durability & Health Monitoring 2006, 2(4), 225-238. https://doi.org/10.3970/sdhm.2006.002.225

Abstract

Numerical T-stress solutions in two dimensional anisotropic cracked bodies are very scarce in the literature. Schemes to evaluate this fracture parameter in anisotropy have been reported only fairly recently. Among them are those developed in conjunction with two different computational techniques, namely, the Boundary Element Method (BEM) and the Scaled Boundary Finite-Element Method (SBFEM). This paper provides a review of the respective schemes using these techniques and demonstrates their efficacy with three examples. These examples, which are of engineering importance, involve cracks lying in a homogeneous medium as well as at the interface between dissimilar media. The numerical T-stress solutions obtained by the two distinct numerical schemes are compared and they show excellent agreement with each other, further establishing the veracity of the two independent methodologies employed. They are also new additions to the very limited number of reference solutions in the literature, particularly for anisotropic elasticity.

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APA Style
Shah, P., Song, C., Tan, C., Wang, X. (2006). Numerical evaluation of t-stress solutions for cracks in plane anisotropic bodies. Structural Durability & Health Monitoring, 2(4), 225-238. https://doi.org/10.3970/sdhm.2006.002.225
Vancouver Style
Shah P, Song C, Tan C, Wang X. Numerical evaluation of t-stress solutions for cracks in plane anisotropic bodies. Structural Durability Health Monit . 2006;2(4):225-238 https://doi.org/10.3970/sdhm.2006.002.225
IEEE Style
P. Shah, C. Song, C. Tan, and X. Wang, “Numerical Evaluation of T-stress Solutions for Cracks in Plane Anisotropic Bodies,” Structural Durability Health Monit. , vol. 2, no. 4, pp. 225-238, 2006. https://doi.org/10.3970/sdhm.2006.002.225



cc Copyright © 2006 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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