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A Frequency Method for Fatigue Life Estimation of Mechanical Components under Bimodal Random Stress Process

by C. Braccesi1, F. Cianetti1, G. Lori1, D. Pioli1

1 University of Perugia, Perugia,Italy. Extended English version of the paper presented at XXXIV AIAS Conference

Structural Durability & Health Monitoring 2005, 1(4), 277-290. https://doi.org/10.3970/sdhm.2005.001.277

Abstract

This paper describes an original frequency method for fatigue life estimation of mechanical components subjected to random inputs. Currently mechanical components life design under random loads is an important task of the research, due to the increasing importance of virtual simulation in opposition to the experimental tests. The frequency domain approach, in this context, seems to be able to supply reliable estimations with small computational effort. The proposed method belongs to the class of corrective coefficient to narrow-band formula methods and it has been thought for bimodal PSDs. The definition of the generalized bimodal processes and the research of the links between corrective coefficient and the system dynamic behaviour are other original aspects of this work.

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APA Style
Braccesi, C., Cianetti, F., Lori, G., Pioli, D. (2005). A frequency method for fatigue life estimation of mechanical components under bimodal random stress process. Structural Durability & Health Monitoring, 1(4), 277-290. https://doi.org/10.3970/sdhm.2005.001.277
Vancouver Style
Braccesi C, Cianetti F, Lori G, Pioli D. A frequency method for fatigue life estimation of mechanical components under bimodal random stress process. Structural Durability Health Monit . 2005;1(4):277-290 https://doi.org/10.3970/sdhm.2005.001.277
IEEE Style
C. Braccesi, F. Cianetti, G. Lori, and D. Pioli, “A Frequency Method for Fatigue Life Estimation of Mechanical Components under Bimodal Random Stress Process,” Structural Durability Health Monit. , vol. 1, no. 4, pp. 277-290, 2005. https://doi.org/10.3970/sdhm.2005.001.277



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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