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Numerical Analysis of Damage Evolution in Ductile Solids

M. Mashayekhi1, S. Ziaei-Rad2, J. Parvizian3, K. Nikbin1, H. Hadavinia1

1 Mechanical Engineering Department Imperial College London South Kensington Campus SW7 2AZ, UK
2 Mechanical Engineering Department Isfahan University of Technology Isfahan, Iran
3 Industrial Engineering Department Isfahan University of Technology Isfahan, Iran

Structural Durability & Health Monitoring 2005, 1(1), 67-82. https://doi.org/10.3970/sdhm.2005.001.067

Abstract

The continuum mechanical simulation of microstructural damage process is important in the study of ductile fracture mechanics. An essential feature in these analyses, is the strong influence of stress triaxiality ratio, i.e. the ratio of mean stress to equivalent stress, on the rate of damage growth. In this paper, finite element simulation of damage evolution and fracture initiation in ductile solids will be investigated. A fully coupled constitutive elastic-plastic-damage model has been implemented. The stress update algorithm for the constitutive model is presented together with the consistent tangent operator, which is needed for implicit FEA. Simulations are performed and the results are compared with the numerical and experimental ones in the literature and good agreements were found between them.

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APA Style
Mashayekhi, M., Ziaei-Rad, S., Parvizian, J., Nikbin, K., Hadavinia, H. (2005). Numerical analysis of damage evolution in ductile solids. Structural Durability & Health Monitoring, 1(1), 67-82. https://doi.org/10.3970/sdhm.2005.001.067
Vancouver Style
Mashayekhi M, Ziaei-Rad S, Parvizian J, Nikbin K, Hadavinia H. Numerical analysis of damage evolution in ductile solids. Structural Durability Health Monit . 2005;1(1):67-82 https://doi.org/10.3970/sdhm.2005.001.067
IEEE Style
M. Mashayekhi, S. Ziaei-Rad, J. Parvizian, K. Nikbin, and H. Hadavinia, “Numerical Analysis of Damage Evolution in Ductile Solids,” Structural Durability Health Monit. , vol. 1, no. 1, pp. 67-82, 2005. https://doi.org/10.3970/sdhm.2005.001.067



cc Copyright © 2005 The Author(s). Published by Tech Science Press.
This work is licensed under a Creative Commons Attribution 4.0 International License , which permits unrestricted use, distribution, and reproduction in any medium, provided the original work is properly cited.
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