Jie-Chao Chen, Rui-Hao Luo, Wu-Zhi Yuan, Nan-Long Hong*, Wen-Hao Wang
Energy Engineering, Vol.119, No.4, pp. 1327-1339, 2022, DOI:10.32604/ee.2022.019331
- 23 May 2022
Abstract For effective water-based thermal management of high heat generating CPU chip, a series of numerical simulation has been conducted to study the effects of heat flux, fin height and flow rate on convective thermal performance of the plate-fin microchannel heat sinks. The characteristics of heat transfer and flow resistance have been quantificationally discussed and JF factor is employed to evaluate the comprehensive efficiency of convective heat transfer of microchannel heat sink. Results show that the increase in fin height and flow rate of cooling water is helpful to decrease the maximum temperature of CPU chip. Large More >
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