Borui Yang¹, Jun Luo², Bo Wan^1,*, Yutai Su^1,3, Guicui Fu¹, Xu Long^3,*

CMES-Computer Modeling in Engineering & Sciences, Vol.130, No.2, pp. 1113-1134, 2022, DOI:10.32604/cmes.2022.018037 - 13 December 2021

Abstract A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment ΔWave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the ΔWave is analyzed. A simplified analytical model of the ΔWave is established using the simulation data. The thermal fatigue lifetime of CBGA packages More >

Shaw-Jyh Shin¹, Chen-Hung Huang², Y.C. Shiah³

CMES-Computer Modeling in Engineering & Sciences, Vol.40, No.1, pp. 83-104, 2009, DOI:10.3970/cmes.2009.040.083

Abstract Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), electronic packages shall experience fatigue failure after going though a period of thermal cycling. As a major means to enhance the reliability of the solder joints, underfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue More >