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    ARTICLE

    Numerical Simulation of Fatigue Crack Growth in Microelectronics Solder Joints

    K. Kaminishi1, M. Iino2, H. Bessho2, M. Taneda3

    CMES-Computer Modeling in Engineering & Sciences, Vol.1, No.1, pp. 107-110, 2000, DOI:10.3970/cmes.2000.001.107

    Abstract An FEA (finite element analysis) program employing a new scheme for crack growth analysis is developed and a prediction method for crack growth life is proposed. The FEA program consists of the subroutines for the automatic element re-generation using the Delaunay Triangulation technique, the element configuration in the near-tip region being provided by a super-element, elasto-inelastic stress analyses, prediction of crack extension path and calculation of fatigue life. The FEA results show that crack extension rate and path are controlled by a maximum opening stress range, Δσθmax, at a small radial distance of r = d, where More >

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