Dong Li¹, Feilong Zhang², Shutao Wang^3,*, Huajian Gao^1,4,*, Xiaodong Chen^2,5,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.32, No.2, pp. 1-2, 2024, DOI:10.32604/icces.2024.011040

Abstract Three-dimensional (3D) architectures and related devices have been widely concerned in recent years due to their unique geometrical advantages and superior performance. Existing approaches to transforming planar thin films into 3D architectures require the use of active materials [1,2] or need substrates to maintain 3D shapes [3,4]. Here, we propose a peeling-induced shape morphing strategy to construct freestanding 3D architectures from 2D plastic films including inert polymers, such as polyethylene terephthalate (PET) and polyimide (PI), which are significant substrate materials for flexible electronics. The plastic strains generated by peeling the film from an adhered plane… More >

Haowen Liang¹, Jiaming Bai^1,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.30, No.2, pp. 1-1, 2024, DOI:10.32604/icces.2024.012563

Abstract Defects are pivotal in influencing the mechanical performance of the hydroxyapatite (HAp) porous structure. In vat photopolymerization (VP) fabrication, directly peeling HAp/polymer green structure from the platform is an efficient approach but often introduces defects, compromising the mechanical performance of sintered HAp scaffolds. The peeling process is a physical phenomenon where the photocured HAp/polymer green structure exhibits resistance against applied peeling forces, which is influenced by its modulus and toughness. In this study, the peeling behavior of cubic-pore HAp (CP-HAp) green structures with varying levels of modulus and toughness was investigated in detail. The characterization… More >

Zhaohe Dai^1,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.26, No.2, pp. 1-1, 2023, DOI:10.32604/icces.2023.09223

Abstract The flexible and clinging nature of ultra-thin films require the understanding of their elastic and adhesive properties in a wide range of circumstances from fabrications to applications. Simultaneously measuring both properties, however, is extremely difficult as the film thickness diminishes to nanoscales. In this talk, I will show our recent work that addresses such difficulties through peeling by vertically pulling thin films off from the substrates (we thus refer to it as “pull-to-peel”). Particularly, we perform in-situ pull-to-peel of graphene and MoS2 films in a scanning electron microscope and achieve simultaneous determination of their Young’s More >