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  • Open Access

    PROCEEDINGS

    Mechanically Programmable Meta-Crystals

    Minh-Son Pham1,*

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.31, No.1, pp. 1-1, 2024, DOI:10.32604/icces.2024.011053

    Abstract Novel properties of meta-materials can be achieved thanks to precisely engineering sophisticated architecture of physical structures (i.e. meta-structuring). However, relying only on the meta-structuring limits possibilities in unlocking new properties, and severely affecting the performance and programmability of meta-materials. In contrast, the metallurgical approach focuses on engineering the natural crystals’ intrinsic microstructure, allowing us to develop metallic alloys with excellent properties and performance beyond what can be obtained by the chemical composition. Recent advances in additive manufacturing (publicly known as 3D printing) enable a precisely metallurgical microstructuring of crystals such as chemical composition, crystal phases More >

  • Open Access

    PROCEEDINGS

    Mechanisms of Thermo-Mechanical Fatigue Crack Growth in a Polycrystalline Ni-Base Superalloy

    Lu Zhang1,*, Yuzhuo Wang1, Zhiwei Yu1, Rong Jiang1, Liguo Zhao1, Yingdong Song1,2

    The International Conference on Computational & Experimental Engineering and Sciences, Vol.30, No.3, pp. 1-2, 2024, DOI:10.32604/icces.2024.012701

    Abstract Thermo-mechanical fatigue (TMF), as the main failure mode of hot components of an aeroengine, are increasingly investigated recently [1,2]. TMF crack growth is studied in a nickel-based powder metallurgy (PM) superalloy subjected to in-phase (IP) and out-of-phase (OP), as well as isothermal fatigue (IF) at peak temperature. The crack growth rate and path are evaluated for both coarse grain (CG) and fine grain (FG) structure, especially the effects of phase angle and polycrystalline microstructure. The results show that the TMF crack propagation is mainly transgranular in OP condition; while in IP condition, crack propagates intergranularly… More >

  • Open Access

    ARTICLE

    Process Modelling and Experimental Analysis of Optimal Specimen Selection in Organic CMCs

    P. V. Rajesh1, Kanak Kalita2,*, Xiao-Zhi Gao3

    CMC-Computers, Materials & Continua, Vol.70, No.2, pp. 2415-2433, 2022, DOI:10.32604/cmc.2022.018247 - 27 September 2021

    Abstract Bone grafting is a surgical restructuring procedure of replacing broken bones and reconstructing missing bone pieces so that complex bone fractures can be repaired to avoid any serious health risk as well as permanent bone disfiguration. Normally, human bones tend to regenerate and heal completely from fracture. But it needs a small scaffold to provide the necessary space to grow. Bone implants allow a broken bone to grow seamlessly. Traditionally, non-corrosive metal alloys are used for fixing broken bones. A metal plate is fastened between two ends of broken bones to join them. However, issues… More >

  • Open Access

    ARTICLE

    First-principles Calculation of Interfacial Adhesion Strength and Electromigration for the Micro-bump Interconnect of 3D Chip Stacking Packaging

    W.H. Chen1, H.C. Cheng2,3, C.F. Yu1,3

    CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001

    Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength… More >

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