Tong An^1,2,*, Rui Zhou^1,2, Fei Qin^1,2,*, Pei Chen^1,2, Yanwei Dai^1,2, Yanpeng Gong^1,2

CMES-Computer Modeling in Engineering & Sciences, Vol.135, No.2, pp. 1481-1502, 2023, DOI:10.32604/cmes.2023.022475 - 27 October 2022

Abstract A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds (IMCs) in solder joints. The effects of the grain aggregate morphology, the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated. The overall strength is predominantly determined by the weak grain interfaces; both the grain aggregate morphology and the weak grain interfaces control the crack configuration; the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining More >

M.A.Arafin¹, J.A.Szpunar²

CMC-Computers, Materials & Continua, Vol.14, No.2, pp. 125-140, 2009, DOI:10.3970/cmc.2009.014.125

Abstract A novel microstructure, texture and grain boundary character based model has been proposed to simulate the intergranular crack propagation behavior in textured polycrystalline materials. The model utilizes the Voronoi algorithm and Monte Carlo simulations to construct the microstructure with desired grain shape factor, takes the texture description of the materials to assign the orientations of the grains, evaluates the grain boundary character based on the misorientation angle - axis calculated from the orientations of the neighboring grains, and takes into account the inclination of grain boundaries with respect to the external stress direction. Markov Chain More >