Liqun Zhou^1,*, Weilin Yang¹, Chaojie Li², Shi Lin³

Frontiers in Heat and Mass Transfer, Vol.22, No.1, pp. 157-173, 2024, DOI:10.32604/fhmt.2023.045135 - 21 March 2024

Abstract The power density of electronic components grows continuously, and the subsequent heat accumulation and temperature increase inevitably affect electronic equipment’s stability, reliability and service life. Therefore, achieving efficient cooling in limited space has become a key problem in updating electronic devices with high performance and high integration. Two-phase immersion is a novel cooling method. The computational fluid dynamics (CFD) method is used to investigate the cooling performance of two-phase immersion cooling on high-power electronics. The two-dimensional CFD model is utilized by the volume of fluid (VOF) method and Reynolds Stress Model. Lee’s model was employed… More > Graphic Abstract

Nugroho Agung Pambudi^*, Awibi Muhamad Yusuf, Alfan Sarifudin

Energy Engineering, Vol.119, No.1, pp. 275-286, 2022, DOI:10.32604/EE.2022.017356 - 22 November 2021

Abstract Data centers are recognized as one of the most important aspects of the fourth industrial revolution since conventional data centers are inefficient and have dependency on high energy consumption, in which the cooling is responsible for 40% of the usage. Therefore, this research proposes the immersion cooling method to solving the high energy consumption of data centers by cooling its component using two types of dielectric fluids. Four stages of experimental methods are used, such as fluid types, cooling effectiveness, optimization, and durability. Furthermore, benchmark software is used to measure the CPU maximum work with More >

Mohamed S. El-Genk^a,b,c,∗, Amir F. Ali^a,c

Frontiers in Heat and Mass Transfer, Vol.3, No.4, pp. 1-14, 2012, DOI:10.5098/hmt.v3.4.3001

Abstract Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal power at junctions’ temperature < 100o C. The spreaders comprise a 1.6 - 3.2 mm thick Cu substrate and an 80-μm thick micro-porous copper (MPC) surface cooled by saturation nucleate boiling of PF-5060 dielectric liquid. Investigated are the effects of varying the heat flux at the chip’s 1 and 4 mm² CHS and the impedance of thermal interface material (TIM) between the Cu substrate and underlying chip. Results confirmed the… More >