Meng Huang, Honglei Wei*, Xianyi Zhai
CMC-Computers, Materials & Continua, Vol.79, No.1, pp. 531-547, 2024, DOI:10.32604/cmc.2024.048510
- 25 April 2024
Abstract In pursuit of cost-effective manufacturing, enterprises are increasingly adopting the practice of utilizing recycled semiconductor chips. To ensure consistent chip orientation during packaging, a circular marker on the front side is employed for pin alignment following successful functional testing. However, recycled chips often exhibit substantial surface wear, and the identification of the relatively small marker proves challenging. Moreover, the complexity of generic target detection algorithms hampers seamless deployment. Addressing these issues, this paper introduces a lightweight YOLOv8s-based network tailored for detecting markings on recycled chips, termed Van-YOLOv8. Initially, to alleviate the influence of diminutive, low-resolution… More >
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