Yi-Che Hsieh^1,*, Ta-Wui Cheng², Chia-Ho Wu²

Journal of Renewable Materials, Vol.8, No.12, pp. 1657-1670, 2020, DOI:10.32604/jrm.2020.013353 - 12 November 2020

Abstract In this study, the feasibility of producing eco-friendly bricks by using geopolymer technology and a waste grinding wheel (WGW) from the grinding wheel industries was investigated. Nowadays, in order to meet industrial needs, for instance, in Taiwan, approximately 500,000 grinding wheels are used annually. That is, a large number of “waste” grinding wheels are produced. Furthermore, few studies have been conducted on the use of WGWs as raw materials in geopolymer applications. The use of geopolymer technology to form bricks can avoid the utilization of clay and cement and even prevent the use of a… More >

Jinxing Li¹, Jun Zhang^1,*, Yunxia Zhou¹, Zhaoling Zhou¹, Hisham Essawy², Xiaojian Zhou^1,*, Guanben Du¹

Journal of Renewable Materials, Vol.8, No.9, pp. 1019-1032, 2020, DOI:10.32604/jrm.2020.012374 - 03 August 2020

Abstract Simple bio-based abrasive grinding wheel based on thermosetting resin matrix was developed starting with condensed tannin and furfuryl alcohol, which are mainly derived from forest and agricultural products like tree barks, wheat and crops. Fourier transform infrared spectra (FTIR) signified the acidic conditions are quiet efficient for the reaction of furfuryl alcohol, urea and glyoxal all together and the -CH₂-NH- and -CH₂-O-CH(OH)- groups are predominating in cross-linking of the tannin-furfuryl alcohol-urea-glyoxal (TFUG) resin. The strengthening contribution of the tannin was also confirmed by the preservation of its distinct crystallinity using X-ray diffraction (XRD). Differential scanning calorimetry… More >

Terry Yuan-Fang Chen, Jian-Siang Chen

The International Conference on Computational & Experimental Engineering and Sciences, Vol.20, No.2, pp. 33-34, 2011, DOI:10.3970/icces.2011.020.033

Abstract Chemical mechanical planarization (CMP) process flattens the wafer by polishing it against a rotating pad. During the polishing process, a diamond coated grinding wheel must be frequently employed to remove the accumulated debris lest the polishing surface glazes. To assure the flatness of polished wafers during the CMP process, the surface warpage of the diamond grid dresser surface must be small enough. In this study, phase-shifted shadow moirAC method was employed to measure the surface profile of diamond grinding wheel, and the warpage was determined by LSM (lease-squares surface method). Since the impinging light may… More >