Thang Q. Tran1,2, Anubhav Sarmah1, Ethan M. Harkin1, Smita Shivraj Dasari1, Kailash Arole1, Matthew Cupich1, Aniela J. K. Wright1, Hang Li Seet2, Sharon Mui Ling Nai2, Micah J. Green1,3,*
The International Conference on Computational & Experimental Engineering and Sciences, Vol.31, No.3, pp. 1-2, 2024, DOI:10.32604/icces.2024.012057
Abstract With the rapid development of high-power integrated electronic devices, many polymer-based thermal management devices have been developed to address the problem of overheating and to improve the reliability and lifetime of electronic devices. Here we demonstrate the material extrusion 3D printing of carbon nanotube (CNT)/silicone heatsinks directly onto electronic devices. CNTs were used as a conductive nanofiller and a rheological modifier to improve thermal and electrical conductivities and the printability of the silicone inks, respectively. Additionally, CNTs are also a radio frequency (RF) susceptor, so the integration of CNTs into the silicone matrix allowed for… More >