Ziad Saghir, Cayley Delisle, Christopher Welsford*
The International Conference on Computational & Experimental Engineering and Sciences, Vol.21, No.1, pp. 19-19, 2019, DOI:10.32604/icces.2019.05145
Abstract The enhancement of consumer and industrial electronics has led to an increase in both the power and compactness of the products available. However, with these increases follows a subsequent increase in the thermal losses experienced across, for example, a central processing unit (CPU). As well, the need to dissipate waste thermal energy is compounded by the increased compactness. As the chipsets become smaller, the threads contained therein also reduce in size and as such become more sensitive to temperature gradients which can cause deformation. Although this deformation is miniscule, its continuous repetition can ultimately result… More >