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  • Open Access

    ARTICLE

    Structural and optical properties of ZnS/rGO nanocomposites optoelectronic devices

    A. M. Abdel-Daiema, M. Ahmeda,, E. R. Shaabanb,

    Chalcogenide Letters, Vol.22, No.2, pp. 131-142, 2025, DOI:10.15251/CL.2025.222.131

    Abstract This paper investigates the impact of reduced graphene oxide (rGO) addition on the structural and optical properties of ZnS nanocomposites. The study began with the synthesis of graphene oxide (GO) through the oxidation of natural graphite powder. This process involved using potassium permanganate in a mixture of sulfuric and phosphoric acids, maintained at 50°C for 48 hours. The reaction was terminated using hydrogen peroxide, followed by purification and drying, yielding 1.5 grams of GO. The preparation of ZnS/GO nanocomposites involved dissolving zinc acetate and varying quantities of GO in water, adjusting the pH, and incorporating… More >

  • Open Access

    ARTICLE

    Thermal stability and crystallization kinetic of Se-Te-Ag glassy alloys and thick films for electronic devices

    K. I. Hussaina, A. Ashourb, E. S. Yousefc, E. R. Shaabanb,d,*

    Chalcogenide Letters, Vol.21, No.1, pp. 65-80, 2024, DOI:10.15251/CL.2024.211.65

    Abstract The present work has examined the thermal features of glassy chacogenide materials Se0.75-xTe0.25Agx (x = 0, 2, 4, 6, 8, 10 at %). The thermal stability of these compositions has been assessed under non-isothermal conditions using Differential Scanning Calorimetry (DSC), which has been used to find the glass transition temperature (Tg), the initial crystallization temperature (Tin), the temperature corresponding to the top of the crystallization rate (Tp), and the melting temperature (Tm). In addition, the kinetic parameter Kr(T) was given as an additional sign of thermal stability. Among these compositions, it was discovered that Se0.71Te0.25Ag0.04… More >

  • Open Access

    ARTICLE

    Fortifying Smart Grids: A Holistic Assessment Strategy against Cyber Attacks and Physical Threats for Intelligent Electronic Devices

    Yangrong Chen1,2, June Li3,*, Yu Xia3, Ruiwen Zhang3, Lingling Li1,2, Xiaoyu Li1,2, Lin Ge1,2

    CMC-Computers, Materials & Continua, Vol.80, No.2, pp. 2579-2609, 2024, DOI:10.32604/cmc.2024.053230 - 15 August 2024

    Abstract Intelligent electronic devices (IEDs) are interconnected via communication networks and play pivotal roles in transmitting grid-related operational data and executing control instructions. In the context of the heightened security challenges within smart grids, IEDs pose significant risks due to inherent hardware and software vulnerabilities, as well as the openness and vulnerability of communication protocols. Smart grid security, distinct from traditional internet security, mainly relies on monitoring network security events at the platform layer, lacking an effective assessment mechanism for IEDs. Hence, we incorporate considerations for both cyber-attacks and physical faults, presenting security assessment indicators and… More > Graphic Abstract

    Fortifying Smart Grids: A Holistic Assessment Strategy against Cyber Attacks and Physical Threats for Intelligent Electronic Devices

  • Open Access

    REVIEW

    A Review of Methods Based on Nanofluids and Biomimetic Structures for the Optimization of Heat Transfer in Electronic Devices

    Lanqi Chen, Yuwei Wang, Cong Qi*, Zhibo Tang, Zhen Tian

    FDMP-Fluid Dynamics & Materials Processing, Vol.18, No.5, pp. 1205-1227, 2022, DOI:10.32604/fdmp.2022.021200 - 27 May 2022

    Abstract Nowadays, the utilization rate of electronic products is increasing while showing no obvious sign of reaching a limit. To solve the associated “internal heat generation problem”, scientists have proposed two methods or strategies. The first approach consists of replacing the heat exchange medium with a nanofluid. However, the high surface energy of the nanoparticles makes them prone to accumulate along the heat transfer surface. The second method follows a different approach. It tries to modify the surface structure of the electronic components in order to reduce the fluid-dynamic drag and improve the rate of heat More > Graphic Abstract

    A Review of Methods Based on Nanofluids and Biomimetic Structures for the Optimization of Heat Transfer in Electronic Devices

  • Open Access

    ARTICLE

    Depression, Anxiety, Stress and Their Association with the Use of Electronic Devices among Adolescents during the COVID-19 Pandemic

    Ahmad Y. Alqassim*, Mohamed S. Mahfouz, Mohammed M. Hakami, Abdullah A. Al Faqih, Ahmad A. Shugairi, Malek R. Alsanosy, Ahmed Y. Rayyani, AbdulAziz Y. Albrraq, Mohammed A. Muaddi, Abdullah A. Alharbi

    International Journal of Mental Health Promotion, Vol.24, No.2, pp. 251-262, 2022, DOI:10.32604/ijmhp.2022.019000 - 18 January 2022

    Abstract Background: Adolescence is a critical, multifactorial developmental phase. With the current pandemic of COVID-19, excessive using of electronic devices is a public health concern. The aim of this study is to investigate the relationship between depression and the use of electronic devices among secondary school children in Jazan, Saudi Arabia during the COVID-19 pandemic. Materials and Methods: The study is an observational, cross-sectional study. Data was collected using an anonymous online survey instrument. including the Depression Anxiety Stress Scale. Results: A total of 427 participants were included in the study. The prevalence of depression, anxiety, and stress… More >

  • Open Access

    ARTICLE

    Rupture and Instability of Soft Films due to Moisture Vaporization in Microelectronic Devices

    Linsen Zhu1, Jiang Zhou2, Xuejun Fan2

    CMC-Computers, Materials & Continua, Vol.39, No.2, pp. 113-134, 2014, DOI:10.3970/cmc.2014.039.113

    Abstract In this paper, a damage mechanics-based continuum theory is developed for the coupled analysis of moisture vaporization, moisture absorption and desorption, heat conduction, and mechanical stress for a reflow process in microelectronic devices. The extremely compliant film has been used in wafer level lamination process. Such a soft film experiences cohesive rupture subjected to moisture absorption during reflow. The numerical simulation results have demonstrated that vapor pressure due to moisture vaporization is the dominant driving force for the failures. The correlation between the vapor pressure evolution and the film rupture observed from the experiments have… More >

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