Jason Velardo^a, Randeep Singh^a,*, Mohammad Shahed Ahamed^a, Masataka Mochizuki^b, Abhijit Date^c, Aliakbar Akbarzadeh^c

Frontiers in Heat and Mass Transfer, Vol.17, pp. 1-11, 2021, DOI:10.5098/hmt.17.1

Abstract Thermal solutions play an integral role in managing heat loads for electronic devices. As these electronics become more compact and portable, improved thermal management solutions need to be introduced. Thin flattened heat pipes (0.8mm – 2.0mm thick) and piezoelectric fans (1mm thick) have been proposed here for this purpose. The maximum heat carrying capacity of the flattened heat pipe was experimentally determined and found to be a function of the flattened heat pipe thickness. Reductions from 48W at 2.0mm to 7W at 0.8mm were observed. This was expected to be due to capillary limitations. The More >

Hui Lu, Xinyue Duan, Minghai Xu^*, Liang Gong, Bin Ding

CMES-Computer Modeling in Engineering & Sciences, Vol.123, No.3, pp. 1193-1204, 2020, DOI:10.32604/cmes.2020.08989 - 28 May 2020

Abstract In micro-manufacturing, roughness is unavoidable due to the tolerance of micro-machining methods. Roughness in microchannel could have a significant influence on flow and heat transfer since the size of microchannel is very small. In our work, roughness is modeled as a superposition of waves. A simple Fourier series method is proposed to construct the rough surface. With this method, roughness is constructed on the bottom of the rectangular microchannel which has a hydraulic diameter of 0.5 mm. Two important parameters during roughness construction, triangulate size and correlation length are studied under the same relative roughness More >

Mustapha Faraji¹, El Alami Mustapha, Najam Mostafa

FDMP-Fluid Dynamics & Materials Processing, Vol.10, No.2, pp. 279-298, 2014, DOI:10.3970/fdmp.2014.010.279

Abstract A study is reported of heat transfer and melting in a fan-less thermal management system consisting of an insulated horizontal cavity filled with a phase change material (PCM) and heated from below by a conducting plate supporting three identical protruding heat sources. Such a PCM enclosure can be used as a heat sink for the cooling of electronic components. The advantage of this cooling strategy is that PCMs characterized by high energy storage density and small transition temperature interval, are able to store a high amount of heat (thereby providing efficient passive cooling). A two-dimensional More >

Peter Kasten^a, Severin Zimmermann^a, Manish K. Tiwari^a, Bruno Michel^b, Dimos Poulikakos^a,*

Frontiers in Heat and Mass Transfer, Vol.1, No.2, pp. 1-10, 2010, DOI:10.5098/hmt.v1.2.3006

Abstract Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water outlet temperature from the heat sink opens the possibility of More >