Baoxia Li1, Wenzhuo Chen1, Xiaojiang Tang1, Shaohuang Bian1, Yang Liu2, Junwei Guo2, Dan Zhang2, Feng Huang2,*
CMC-Computers, Materials & Continua, Vol.80, No.2, pp. 2221-2236, 2024, DOI:10.32604/cmc.2024.049862
- 15 August 2024
Abstract Complex plasma widely exists in thin film deposition, material surface modification, and waste gas treatment in industrial plasma processes. During complex plasma discharge, the configuration, distribution, and size of particles, as well as the discharge glow, strongly depend on discharge parameters. However, traditional manual diagnosis methods for recognizing discharge parameters from discharge images are complicated to operate with low accuracy, time-consuming and high requirement of instruments. To solve these problems, by combining the two mechanisms of attention mechanism (strengthening the extraction of the channel feature) and shortcut connection (enabling the input information to be directly… More >
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