Mohamed S. El-Genka,b,c,∗, Amir F. Alia,c
Frontiers in Heat and Mass Transfer, Vol.3, No.4, pp. 1-14, 2012, DOI:10.5098/hmt.v3.4.3001
Abstract Advanced spreaders for cooling a 10 x 10 mm underlying computer chip with a central hot spot (CHS) could remove > 85 W of dissipated thermal
power at junctions’ temperature < 100o
C. The spreaders comprise a 1.6 - 3.2 mm thick Cu substrate and an 80-μm thick micro-porous copper (MPC)
surface cooled by saturation nucleate boiling of PF-5060 dielectric liquid. Investigated are the effects of varying the heat flux at the chip’s 1 and 4
mm2
CHS and the impedance of thermal interface material (TIM) between the Cu substrate and underlying chip. Results confirmed the… More >
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