Jaewook Lee¹, Byung-Dae Park^1,*, Qinglin Wu²

Journal of Renewable Materials, Vol.12, No.7, pp. 1187-1205, 2024, DOI:10.32604/jrm.2024.049948 - 21 August 2024

Abstract Lignin is the most abundant aromatic natural polymer, and receiving great attention in replacing various petroleum-based polymers. The aim of this study is to investigate the feasibility of technical lignin as a polyol for the synthesis of non-isocyanate polyurethane (NIPU) adhesives to substitute current polyurethane (PU) adhesives that have been synthesized with toxic isocyanate and polyols. Crude hardwood kraft lignin (C-HKL) was extracted from black liquor from a pulp mill followed by acetone fractionation to obtain acetone soluble-HKL (AS-HKL). Then, C-HKL, AS-HKL, and softwood sodium lignosulfonate (LS) were used for the synthesis of technical lignin-based… More > Graphic Abstract

W.H. Chen¹, H.C. Cheng^2,3, C.F. Yu^1,3

CMES-Computer Modeling in Engineering & Sciences, Vol.109-110, No.1, pp. 1-13, 2015, DOI:10.3970/cmes.2015.109.001

Abstract This study aims at exploring the interfacial adhesion strength between solder bump and four typical under bump metallurgies (UBMs), i.e., Cu/Ni, Cu/TiW, Cu/Ni/Cr and /Cu/V/Cr, at atomistic scale. The average bond length and interfacial adhesion stress of the Sn-3.5Ag/Cu/Ni, Sn-3.5Ag/Cu/TiW, Sn-3.5Ag/Cu/Ni/Cr and Sn-3.5Ag/Cu/V/Cr micro-bump interconnects are calculated through the firstprinciples density functional theory (DFT) calculation to estimate the interfacial adhesion strength between the solder bump and UBMs. In addition, by investigating the electric field effect on the average bond length and adhesive stress, the combination of solder bump and UBM with better interfacial adhesion strength… More >

E. Takai¹, R. Landesberg², R.W. Katz², C.T. Hung³, X.E Guo^1,4

Molecular & Cellular Biomechanics, Vol.3, No.1, pp. 1-12, 2006, DOI:10.3970/mcb.2006.003.001

Abstract Osteoblast interactions with extracellular matrix (ECM) proteins are known to influence many cell functions, which may ultimately affect osseointegration of implants with the host bone tissue. Some adhesion-mediated events include activation of focal adhesion kinase, and subsequent changes in the cytoskeleton and cell morphology, which may lead to changes in adhesion strength and cell responsiveness to mechanical stimuli. In this study we examined focal adhesion kinase activation (FAK), F-actin cytoskeleton reorganization, adhesion strength, and osteoblast responsiveness to fluid shear when adhered to type I collagen (ColI), glass, poly-L-lysine (PLL), fibronectin (FN), vitronectin (VN), and serum… More >