Ki-Yeol Eom1, Byungseok Min2,*
CMC-Computers, Materials & Continua, Vol.75, No.3, pp. 6337-6350, 2023, DOI:10.32604/cmc.2023.035336
Abstract Automated X-ray defect inspection of occluded objects has been an essential topic in semiconductors, autonomous vehicles, and artificial intelligence devices. However, there are few solutions to segment occluded objects in the X-ray inspection efficiently. In particular, in the Ball Grid Array inspection of X-ray images, it is difficult to accurately segment the regions of occluded solder balls and detect defects inside solder balls. In this paper, we present a novel automatic inspection algorithm that segments solder balls, and detects defects fast and efficiently when solder balls are occluded. The proposed algorithm consists of two stages.… More >
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