Shaw-Jyh Shin1, Chen-Hung Huang2, Y.C. Shiah3
CMES-Computer Modeling in Engineering & Sciences, Vol.40, No.1, pp. 83-104, 2009, DOI:10.3970/cmes.2009.040.083
Abstract Owing to the CTE (Coefficient of Thermal Expansion) mismatch among solder joints, IC (Integrated Circuit) chip, and PCB (Printed Circuit Board), electronic packages shall experience fatigue failure after going though a period of thermal cycling. As a major means to enhance the reliability of the solder joints, underfill is often dispensed to fill the gap between the die and the substrate. This study aims at investigating how the underfill may affect the thermal fatigue life of WLCSP (Wafer Level Chip Scale Package) by means of FEA (finite element analysis). In this study, the thermal fatigue More >
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