Heng Cheng Lin1,2, Chieh Kung3, Rong Sheng Chen2
CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 43-50, 2007, DOI:10.3970/cmc.2007.006.043
Abstract Presented herein are the evaluation results of the BGA solder ball shape using energy method, two types of solder, viz. Sn37Pb and Sn80Pb, are selected .The geometry of the solder bump is firstly estimated using free computer software, the Surface Evolver, an interactive program which is an energy-based approach for the study of liquid droplet surfaces shaped by surface tension and other energies. The solder bump is then numerically constructed in a finite element model that simulates a BGA package. The influences of both upper and bottom solder pad radii, the surface tension on the… More >
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