Wen-Hwa Chen1,2, Shu-Ru Lin2, Kuo-Ning Chiang2,3
CMC-Computers, Materials & Continua, Vol.2, No.3, pp. 151-162, 2005, DOI:10.3970/cmc.2005.002.151
Abstract As ultra-fine-pitch technologies are adopted to enhance the performance of electronic packaging, solder bridging becomes an urgently serious defect. This work presents a computational model using the Surface Evolver program to analyze the stability of solder bridging for area array type packaging. Several factors that affect the stability of solder bridging spanning two identical circular pads are considered herein, including the pad size, the total volume of solder bumps, the pitch between adjacent pads, the contact angle between the molten solder alloy and the pad, the contact angle between the molten solder alloy and the… More >
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