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    REVIEW

    REVIEW OF VARIOUS THIN HEAT SPREADER VAPOR CHAMBER DESIGNS, PERFORMANCE, LIFETIME RELIABILITY AND APPLICATION

    Masataka Mochizukia,*,†, Thang Nguyenb

    Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-6, 2019, DOI:10.5098/hmt.13.12

    Abstract The cooling device for computers and electronics is getting smaller and thinner year after year, especially for the mobile handheld device such as smartphone which is the most popular gadget and widely use nowadays. It seems that in the current trend every 6-12 months a new model of smartphone is introduced and it was packed with faster processing processor, memories, and graphics, higher density battery, higher resolution for camera and video and so on. The drawback is the device getting hotter due to the increase of heat dissipation caused by faster computing. The traditional method… More >

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