Zone-Ching Lin1and Ren-Yuan Wang1
CMC-Computers, Materials & Continua, Vol.16, No.3, pp. 247-272, 2010, DOI:10.3970/cmc.2010.016.247
Abstract The paper establishes a new three-dimensional quasi-steady molecular statics nanoscale abrasive cutting model to investigate the abrasive cutting behavior in the downpressing and abrasive cutting process of a workpiece in chemical mechanical polishing (CMP) process. The downpressing and abrasive cutting process is a continuous process. The abrasive cutting process is done after the single abrasive particle has downpressed and penetrated a workpiece to a certain depth of a workpiece. The paper analyzes the effects of the abrasive particles with different diameters on action force. It also analyzes the action force change of abrasive particles with… More >
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