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    ARTICLE

    Bond Graph Modelling and Simulation of Static Recrystallization Kinetics in Multipass Hot Steel Rolling

    S.K. Pal1, D.A. Linkens2

    CMC-Computers, Materials & Continua, Vol.2, No.2, pp. 113-118, 2005, DOI:10.3970/cmc.2005.002.113

    Abstract In hot rolling, the final thickness of the strip is achieved through plastic deformation of the original stock by a series of counter-rotating rollers. In this work, static recrystallization kinetics in between two stages of steel rolling has been modelled, and simulation studies have also been performed to find out the effect of entry temperature on the recrystallization kinetics. A viable bond graph model has been developed to study the kinetics of the process. Low-carbon steel has been considered for this purpose. More >

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