Dong-Wook Lee^1,*, Heungjo An², Tae Yeon Kim³, Sungmun Lee⁴, Jide Oyebanji¹, Prabakaran Balasubramanian¹

The International Conference on Computational & Experimental Engineering and Sciences, Vol.31, No.2, pp. 1-1, 2024, DOI:10.32604/icces.2024.011286

Abstract This work analyzes the problems of material elastic constants identification and residual stresses determination in an orthotropic materials using hole drilling method. These problems are very important to understand mechanical performance of materials. A lot of optical method such as Moiré, laser speckle interferometry, digital image correlation or photoelasticity is developed to estimate displacement (or strain) fields or applied loads (or stresses) from images. These methods require a very complicated techniques, skill, and efforts to analysis images. But deep learning method based on a convolution neural network shows better performance in image analysis problems such… More >

H. C. Cheng¹, C. Y. Yu², W. H. Chen³

CMES-Computer Modeling in Engineering & Sciences, Vol.7, No.1, pp. 1-18, 2005, DOI:10.3970/cmes.2005.007.001

Abstract In this study, a simple but effective solution methodology that integrates a modified global/local finite element (GLFE) modeling technique and a two-staged constitutive modeling strategy is presented for the thermal-mechanical modeling of solder joints in an area array typed electronic package for characterizing the associated solder joint fatigue life under the JEDEC temperature cycling specification. The effectiveness and applicability of the proposed technique are demonstrated through two case studies, each of which is associated with an area array typed test vehicle. The geometry profile of solder joints in the test vehicle is determined by the… More >