Yewon Choi^1,2, Song Hyeon Ju², Jungsoo Nam^2,*, Min Ku Kim^1,3,*

CMES-Computer Modeling in Engineering & Sciences, Vol.146, No.1, 2026, DOI:10.32604/cmes.2025.071817 - 29 January 2026

Abstract The composite material layering process has attracted considerable attention due to its production advantages, including high scalability and compatibility with a wide range of raw materials. However, changes in process conditions can lead to degradation in layer quality and non-uniformity, highlighting the need for real-time monitoring to improve overall quality and efficiency. In this study, an AI-based monitoring system was developed to evaluate layer width and assess quality in real time. Three deep learning models Faster Region-based Convolutional Neural Network (R-CNN), You Only Look Once version 8 (YOLOv8), and Single Shot MultiBox Detector (SSD) were… More >

Jia Yan Lim^1,2, Siti Madiha Muhammad Amir³, Roslan Yahya³, Marta Peña Fernández², Tze Chuen Yap^1,*

CMC-Computers, Materials & Continua, Vol.86, No.2, pp. 1-19, 2026, DOI:10.32604/cmc.2025.070707 - 09 December 2025

Abstract Additive Manufacturing, also known as 3D printing, has transformed conventional manufacturing by building objects layer by layer, with material extrusion or fused deposition modeling standing out as particularly popular. However, due to its manufacturing process and thermal nature, internal voids and pores are formed within the thermoplastic materials being fabricated, potentially leading to a decrease in mechanical properties. This paper discussed the effect of printing parameters on the porosity and the mechanical properties of the 3D printed polylactic acid (PLA) through micro-computed tomography (microCT), computational image analysis, and Charpy impact testing. The results for both… More >

Thang Q. Tran^1,2, Anubhav Sarmah¹, Ethan M. Harkin¹, Smita Shivraj Dasari¹, Kailash Arole¹, Matthew Cupich¹, Aniela J. K. Wright¹, Hang Li Seet², Sharon Mui Ling Nai², Micah J. Green^1,3,*

The International Conference on Computational & Experimental Engineering and Sciences, Vol.31, No.3, pp. 1-2, 2024, DOI:10.32604/icces.2024.012057

Abstract With the rapid development of high-power integrated electronic devices, many polymer-based thermal management devices have been developed to address the problem of overheating and to improve the reliability and lifetime of electronic devices. Here we demonstrate the material extrusion 3D printing of carbon nanotube (CNT)/silicone heatsinks directly onto electronic devices. CNTs were used as a conductive nanofiller and a rheological modifier to improve thermal and electrical conductivities and the printability of the silicone inks, respectively. Additionally, CNTs are also a radio frequency (RF) susceptor, so the integration of CNTs into the silicone matrix allowed for… More >