Taidong Xu1,2, Hao Liu2, Dejun Zhang1,2, Yadong Li2, Xiaoming Zhou2,*
FDMP-Fluid Dynamics & Materials Processing, Vol.17, No.1, pp. 109-121, 2021, DOI:10.32604/fdmp.2021.010608
- 09 February 2021
Abstract With the progressive increase in the number of transistors that can be accommodated on a single integrated circuit, new strategies are needed to extract heat from these devices in an efficient way. In this regard methods based on the combination of the so-called “jet impingement” and “micro-channel” approaches seem extremely promising for possible improvement and future applications in electronics as well as the aerospace and biomedical fields. In this paper, a hybrid heat sink based on these two technologies is analysed in the frame of an integrated model. Dedicated CFD simulation of the coupled flow/temperature More >