Yao Hsu1, Chih-Yen Su2, Wen-Fang Wu3,4
CMC-Computers, Materials & Continua, Vol.36, No.2, pp. 155-176, 2013, DOI:10.3970/cmc.2013.036.155
Abstract To study the fatigue reliability of a flip-chip chip scale package (FCCSP) subject to thermal cyclic loading, a Monte Carlo simulation-based parametric study is carried out in the present study. A refined procedure as compared with the recently released Probabilistic Design System (PDS) of ANSYS is proposed and employed in particular. The thermal-cyclic fatigue life of the package is discussed in detail since it is related directly to the reliability of the package. In consideration of the analytical procedure as well as real manufacturing processes, a few geometric dimensions and material properties of the package More >
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