Chang-Chun Lee1,*, Pei-Chen Huang1
CMES-Computer Modeling in Engineering & Sciences, Vol.120, No.2, pp. 239-260, 2019, DOI:10.32604/cmes.2019.06859
Abstract This research reviews the application of computational mechanics on the properties of nano/micro scaled thin films, in which the application of different computational methods is included. The concept and fundamental theories of concerned applications, material behavior estimations, interfacial delamination behavior, strain engineering, and multilevel modeling are thoroughly discussed. Moreover, an example of an interfacial adhesion estimation is presented to systematically estimate the related mechanical reliability issue in the microelectronic industry. The presented results show that the peeled mode fracture is the dominant delamination behavior of layered material system, with high stiffness along the bonding interface. More >
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