Tong An^1,2,*, Rui Zhou^1,2, Fei Qin^1,2,*, Pei Chen^1,2, Yanwei Dai^1,2, Yanpeng Gong^1,2

CMES-Computer Modeling in Engineering & Sciences, Vol.135, No.2, pp. 1481-1502, 2023, DOI:10.32604/cmes.2023.022475 - 27 October 2022

Abstract A micromechanical model is presented to study the initiation and propagation of microcracks of intermetallic compounds (IMCs) in solder joints. The effects of the grain aggregate morphology, the grain boundary defects and the sensitivity of the various cohesive zone parameters in predicting the overall mechanical response are investigated. The overall strength is predominantly determined by the weak grain interfaces; both the grain aggregate morphology and the weak grain interfaces control the crack configuration; the different normal and tangential strengths of grain interfaces result in different intergranular cracking behaviors and play a critical role in determining More >

A. Ataş¹, C. Soutis²

CMC-Computers, Materials & Continua, Vol.34, No.3, pp. 199-226, 2013, DOI:10.3970/cmc.2013.034.199

Abstract A strength prediction method is presented for double-lap single fastener bolted joints of cross-ply carbon fibre reinforced plastic (CFRP) composite laminates using cohesive zone elements (CZEs). Three-dimensional finite element models were developed and CZEs were inserted into subcritical damage planes identified from X-ray radiographs. The method makes a compromise between the experimental correlation factors (dependant on lay-up, stacking sequence and joint geometry) and three material properties (fracture energy, interlaminar strength and nonlinear shear stress-strain response). Strength of the joints was determined from the predicted load-displacement curves considering sub-laminate and plylevel scaling effects. The predictions are More >