R. VENKATESAN*, S. R. DARSON IMMANUEL JOHN, N. RAJESWARI
Journal of Polymer Materials, Vol.36, No.3, pp. 261-273, 2019, DOI:10.32381/JPM.2019.36.03.6
Abstract Nanocomposite films of chitosan (CH) incorporated with different wt. % of the
polyoligomericsilsesquioxane (POSS) were prepared by solution casting. The thermal,
mechanical, morphological and antimicrobial properties of the nanocomposites were examined.
TGA analyses of the nanocomposites indicate that the filler enables the enhancement of thermal
stability of chitosan. The tensile strength of the nanocomposite films is enhanced (10.9 MPa
for neat chitosan to 24.0MPa for 5wt. % filled chitosan) by the addition of POSS while the
elongation at break is reduced. The nanocomposite films exhibited excellent antimicrobial
activity against both gram positive and gram negative More >
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