Ki-Yeol Eom¹, Byungseok Min^2,*

CMC-Computers, Materials & Continua, Vol.75, No.3, pp. 6337-6350, 2023, DOI:10.32604/cmc.2023.035336 - 29 April 2023

Abstract Automated X-ray defect inspection of occluded objects has been an essential topic in semiconductors, autonomous vehicles, and artificial intelligence devices. However, there are few solutions to segment occluded objects in the X-ray inspection efficiently. In particular, in the Ball Grid Array inspection of X-ray images, it is difficult to accurately segment the regions of occluded solder balls and detect defects inside solder balls. In this paper, we present a novel automatic inspection algorithm that segments solder balls, and detects defects fast and efficiently when solder balls are occluded. The proposed algorithm consists of two stages.… More >

Borui Yang¹, Jun Luo², Bo Wan^1,*, Yutai Su^1,3, Guicui Fu¹, Xu Long^3,*

CMES-Computer Modeling in Engineering & Sciences, Vol.130, No.2, pp. 1113-1134, 2022, DOI:10.32604/cmes.2022.018037 - 13 December 2021

Abstract A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment ΔWave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the ΔWave is analyzed. A simplified analytical model of the ΔWave is established using the simulation data. The thermal fatigue lifetime of CBGA packages More >

Heng Cheng Lin^1,2, Chieh Kung³, Rong Sheng Chen²

CMC-Computers, Materials & Continua, Vol.6, No.1, pp. 43-50, 2007, DOI:10.3970/cmc.2007.006.043

Abstract Presented herein are the evaluation results of the BGA solder ball shape using energy method, two types of solder, viz. Sn37Pb and Sn80Pb, are selected .The geometry of the solder bump is firstly estimated using free computer software, the Surface Evolver, an interactive program which is an energy-based approach for the study of liquid droplet surfaces shaped by surface tension and other energies. The solder bump is then numerically constructed in a finite element model that simulates a BGA package. The influences of both upper and bottom solder pad radii, the surface tension on the… More >