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    ARTICLE

    MD Simulation of Diffusion Behaviors in Collision Welding Processes of Al-Cu, Al-Al, Cu-Cu

    Dingyi Jin1, Guo Wei2,*

    CMC-Computers, Materials & Continua, Vol.79, No.3, pp. 3455-3468, 2024, DOI:10.32604/cmc.2024.048644

    Abstract To investigate the effects of material combinations and velocity conditions on atomic diffusion behavior near collision interfaces, this study simulates the atomic diffusion behavior near collision interfaces in Cu-Al, Al-Al and Cu-Cu combinations fabricated through collision welding using molecular dynamic (MD) simulation. The atomic diffusion behaviors are compared between similar metal combinations (Al-Al, Cu-Cu) and dissimilar metal combinations (Al-Cu). By combining the simulation results and classical diffusion theory, the diffusion coefficients for similar and dissimilar metal material combinations under different velocity conditions are obtained. The effects of material combinations and collision velocity on diffusion behaviors More >

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