Borui Yang1, Jun Luo2, Bo Wan1,*, Yutai Su1,3, Guicui Fu1, Xu Long3,*
CMES-Computer Modeling in Engineering & Sciences, Vol.130, No.2, pp. 1113-1134, 2022, DOI:10.32604/cmes.2022.018037
- 13 December 2021
Abstract A thermal fatigue lifetime prediction model of ceramic ball grid array (CBGA) packages is proposed based on the Darveaux model. A finite element model of the CBGA packages is established, and the Anand model is used to describe the viscoplasticity of the CBGA solder. The average viscoplastic strain energy density increment ΔWave of the CBGA packages is obtained using a finite element simulation, and the influence of different structural parameters on the ΔWave is analyzed. A simplified analytical model of the ΔWave is established using the simulation data. The thermal fatigue lifetime of CBGA packages More >
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