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    ARTICLE

    BEM Analysis of 3D Heat Conductionin 3D Thin Anisotropic Media

    Y.C. Shiah1, Y.M. Lee2, Chi-Chang Wang2

    CMC-Computers, Materials & Continua, Vol.33, No.3, pp. 229-255, 2013, DOI:10.3970/cmc.2013.033.229

    Abstract In this paper, the boundary integrals for treating 3D field problems are fully regularized for planar elements by the technique of integration by parts (IBP). As has been well documented in open literatures, these integrals appear to be strongly singular and hyper-singular for the associated fundamental solutions. In the past, the IBP approach has only been applied to regularize the integrals for 2D problems. The present work shows that the IBP can also be further extended to treat 3D problems, where two variables of the local coordinates are involved. The presented formulations are fully explicit More >

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