Juan Fang1,*, Yunfei Mao1, Min Cai1, Li’ang Zhao1, Huijie Chen1, Wei Xiang2,3
CMC-Computers, Materials & Continua, Vol.72, No.3, pp. 5531-5545, 2022, DOI:10.32604/cmc.2022.027177
- 21 April 2022
Abstract Since the three-dimensional Network on Chip (3D NoC) uses through-silicon via technology to connect the chips, each silicon layer is conducted through heterogeneous thermal, and 3D NoC system suffers from thermal problems. To alleviate the seriousness of the thermal problem, the distribution of data packets usually relies on traffic information or historical temperature information. However, thermal problems in 3D NoC cannot be solved only based on traffic or temperature information. Therefore, we propose a Score-Based Traffic- and Thermal-Aware Adaptive Routing (STTAR) that applies traffic load and temperature information to routing. First, the STTAR dynamically adjusts… More >
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