B. Orra,*
, R. Singha, T. L. Phana
, M. Mochizukib
Frontiers in Heat and Mass Transfer, Vol.13, pp. 1-6, 2019, DOI:10.5098/hmt.13.1
Abstract One of the problems with cooling an IGBT inverter chip is that its heat generation is not constant. These chips tend to produce heat in pulses which
results in high peak chip temperatures. Transient modelling is required to determine the suitability of a heat sink and to ensure the max peak
temperature is not exceeded. This paper demonstrates a method of transient thermal analysis using a thermal resistance / capacitor network. A sample
heat sink was modelled and then experimentally tested to validate the model. A novel method of modelling phase change materials (PCM) using More >
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