Aravind Sathyanarayanaa, Pramod Warrierb, Yogendra Joshia,*, Amyn Tejab
Frontiers in Heat and Mass Transfer, Vol.2, No.4, pp. 1-7, 2011, DOI:10.5098/hmt.v2.4.3007
Abstract Electrical and chemical compatibility requirements of electronic components pose significant constraints on the choice of liquid coolants. Dielectric
coolants such as Novec fluids and fluoroinerts are plagued by poor thermal properties. This necessitates the development of new heat transfer fluids.
In this study we examine mixture formulations that provide an avenue for enhancing the properties of existing heat transfer fluids. Mixture
formulations of Novec fluid (HFE 7200) with Methanol and Ethoxybutane are considered. Pool boiling experiments are performed on a copper
nanowire surface. The results show an improvement of 24% and 11% in the CHF More >
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