Jason Velardoa, Randeep Singha,*, Mohammad Shahed Ahameda, Masataka Mochizukib, Abhijit Datec, Aliakbar
Akbarzadehc
Frontiers in Heat and Mass Transfer, Vol.17, pp. 1-11, 2021, DOI:10.5098/hmt.17.1
Abstract Thermal solutions play an integral role in managing heat loads for electronic devices. As these electronics become more compact and portable,
improved thermal management solutions need to be introduced. Thin flattened heat pipes (0.8mm – 2.0mm thick) and piezoelectric fans (1mm thick)
have been proposed here for this purpose. The maximum heat carrying capacity of the flattened heat pipe was experimentally determined and found
to be a function of the flattened heat pipe thickness. Reductions from 48W at 2.0mm to 7W at 0.8mm were observed. This was expected to be due to
capillary limitations. The More >
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