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TSP Journals Successfully Indexed by EBSCO
JRM Achieves Top 5 Ranking in IAWS Journal List for Wood Science & Technology
Call for Early Career Editorial Board Members and Reviewers
Tsinghua University Press and Tech Science Press Collaborate to Bring 11 Journals to SciOpen Platform
Tech Science Press Journals Now Available on PubScholar Platform
30th ICCES2024 Concludes Successfully in Singapore
Professor Charles Ling named Editor-in-Chief of Computers, Materials & Continua.
Professor Timon Rabczuk named the Editor-in-Chief of Computers, Materials & Continua.
The International Conference on Computational & Experimental Engineering and Sciences (ICCES 2019)....
Professor Shaofan Li named Editor-in-Chief of Computer Modeling in Engineering and Sciences.
The 4th International Conference on Cloud Computing and Security (ICCCS 2018) will be held in June,...
A new Submission system is launched on January 10, 2018.
Tech Science Press (TSP) appoints Professor Maosen Cao as the new Editor-in-Chief of Structural Durability...
Tech Science Press is launching a new journal: Journal of Advanced Optics and Photonics (JAOP) .
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