Tech Science Press Shares Integrity Insights on AI-Enabled Paper Mills at Charleston Asia Conference
TSP Establishes Strategic Cooperation with Chinese Medical Association Publishing House (CMAPH)
Prof. Lin Lu Appointed Editor-in-Chief of Energy Engineering
Two More Tech Science Press Journals Now Indexed in Chemical Abstracts Service (CAS) Databases
Attention users of TSP Online Submission System:
Please be aware that TSP Online Submission System (ijs.tspsubmission.com) will be unavailable at 21:00 (Mar 11 2023, UTC-8) to 01:00 (Mar 12 2023, UTC-8) as the IT team will be performing scheduled maintenance at this time. The users of OJS submission system (CMES, FDMP, MCB, SDHM, JRM, BIOCELL, Phyton, SV, EE, IJMHP, CHD, OR) will not be affected.
During this time, you will be unable to use the submission system. Please make sure to save necessary information before the maintenance.
We apologize for any inconvenience this may cause and we are working to ensure that the maintenance is completed as quickly and efficiently as possible.
Thank you for your patience and understanding.