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Optimal Substrate Shape for Vesicle Adhesion on a Curved Substrate

Wendong Shi∗,†, Xi-Qiao Feng*, Huajian Gao

* Department of Engineering Mechanics, Tsinghua University, Beijing 100084, P.R. China
Division of Engineering, Brown University, 182 Hope Street, Providence, RI 02912

TSP_MCB_121.pdf

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